"There are several reasons why advanced packaging technologies like TSMC's CoWoS and InFO, as well as Intel's EMIB and Foveros, are gaining importance."
One can also do a more tailored design as well. e.g. mixed analog/digital, etc.Reply
OSATs have the capabilities as mentioned in the article, with the exception of wafer-to-wafer bonding, which is not really needed unless you are stacking memory or specialty wafers. The abilities for both traditional and advanced packaging capabilities are much more extensive in the OSATs and will continue to add value as the heterogeneous integration design strategy expands. TSMC has the leadership position because of 1 main reason- they want to sell their next generation silicon node wafers at very high prices and by offering the advanced packaging with this, they are able to lock their customers in. With Samsung and Intel offering adv. nodes as well, more companies will be looking to leverage on "open source" network of advanced packaging suppliers and the OSAT's have the edge with the broad range of packaging tools at their disposal for system level integration.Reply
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Threska - Tuesday, October 17, 2023 - link
"There are several reasons why advanced packaging technologies like TSMC's CoWoS and InFO, as well as Intel's EMIB and Foveros, are gaining importance."One can also do a more tailored design as well. e.g. mixed analog/digital, etc. Reply
PackagingGuru - Tuesday, October 17, 2023 - link
OSATs have the capabilities as mentioned in the article, with the exception of wafer-to-wafer bonding, which is not really needed unless you are stacking memory or specialty wafers. The abilities for both traditional and advanced packaging capabilities are much more extensive in the OSATs and will continue to add value as the heterogeneous integration design strategy expands. TSMC has the leadership position because of 1 main reason- they want to sell their next generation silicon node wafers at very high prices and by offering the advanced packaging with this, they are able to lock their customers in. With Samsung and Intel offering adv. nodes as well, more companies will be looking to leverage on "open source" network of advanced packaging suppliers and the OSAT's have the edge with the broad range of packaging tools at their disposal for system level integration. Reply