POST A COMMENT

16 Comments

Back to Article

  • FWhitTrampoline - Monday, September 18, 2023 - link

    Maybe call that a Glass Interposer instead as that's what that in fact is! So the Traces density on Glass as opposed to Organic Substrate(PCB like material). Reply
  • edzieba - Tuesday, September 19, 2023 - link

    It's not an interpose. The wafer is integrated onto the substrate in the same way as any other flip-chip process, not in the wafer-to-wafer bonding of a Si interposer. Reply
  • xol - Monday, September 18, 2023 - link

    Suprised no mention of Silicon Nitride which has all the good properties of glass, plus even closer thermal expansion coefficient to silicon, AND excellent thermal conductivity. Reply
  • Kamen Rider Blade - Monday, September 18, 2023 - link

    Interesting, how far along is Silicon Nitride as a PCB substrate? Reply
  • xol - Tuesday, September 19, 2023 - link

    i dunno.. but as a material it's in common use in semiconductor processes, so... Reply
  • Starfishprime79 - Tuesday, September 19, 2023 - link

    SiN has poor electrical properties, specifically very high Dk. Why glass is superior. Reply
  • Kevinlangford - Monday, September 18, 2023 - link

    couple more tubes of thermal paste should do the trick! Reply
  • Dante Verizon - Monday, September 18, 2023 - link

    Intel has become a company of promises, I tend not to believe anything they announce that they will achieve in the future. Reply
  • name99 - Monday, September 18, 2023 - link

    Your annual reminder that when Intel announces a tech, it does NOT mean that Intel is the only company with that tech, or even first with that tech; just that Intel has the loudest megaphone.

    Other companies are also working on glass substrates and (assuming the Japanese translation is accurate...) https://eetimes.itmedia.co.jp/ee/articles/2210/25/... Apple is already using a version as the substrate for the A16.
    Reply
  • edzieba - Tuesday, September 19, 2023 - link

    That's just Apple's marketing department at work. "Epoxy glass substrate " is the organic substrate everyone has been using for decades. Reply
  • PeachNCream - Tuesday, September 19, 2023 - link

    Will this magically reduce power consumption and heat output enough so that Intel will be able to list a TDP that accurately represents the maximum state of the CPU or is that still going to be hidden away and relatively unknown? Reply
  • edzieba - Tuesday, September 19, 2023 - link

    That's not what TDP measures, and has not been (for Intel, AMD, or mobile SoCs) for well over a decade. Reply
  • PeachNCream - Wednesday, September 20, 2023 - link

    I see you've fallen prey to the marketing department. Good to know nerds are easy prey. Reply
  • dwillmore - Tuesday, September 19, 2023 - link

    Interesting tht the company which drove the industry away from glass in the 90's is now leading the charge back there after an almost three decade diversion to organic substrates. Reply
  • tipoo - Tuesday, September 19, 2023 - link

    Is anyone on Anandtech planning a deep dive into A17 Pro? I'd love to see it Reply
  • Mantion - Wednesday, September 27, 2023 - link

    so much hype for something that isn't a solution to a non-problem. Reply

Log in

Don't have an account? Sign up now