Memory
Samsung’s annual Memory Tech Day is taking place in San Jose this morning, and as part of the event, the company is making a couple of notable memory technology announcements/disclosures. The highlight of Samsung’s event is the introduction of Shinebolt, Samsung’s HBM3E memory that will set new marks for both memory bandwidth and memory capacity for high-end processors. The company is also disclosing a bit more on their GDDR7 memory, which will mark a significant technological update to the GDDR family of memory standards.
TeamGroup Announces 32GB T-Force Vulcan Z and Dark Z DDR4 Modules
One of the world's largest DRAM memory manufacturers TeamGroup has unveiled its first DDR4 memory kits featuring 32 GB sticks under its gaming-focused T-Force brand. The T-Force Vulcan Z...
7 by Gavin Bonshor on 3/27/2020
Samsung to Produce DDR5 in 2021 (with EUV)
Samsung is on track to start volume production of DDR5 and LPDDR5 memory next year using a manufacturing technology that will take advantage of extreme ultraviolet lithography (EUVL). In...
20 by Anton Shilov on 3/25/2020
GlobalFoundries & Everspin Extend MRAM Pact to 12nm
GlobalFoundries and Everspin have announced that the two have extended their Spin-transfer Torque (STT-MRAM) joint development agreement (JDA) to 12LP (12 nm FinFET) platform. The extension will enable GlobalFoundries...
4 by Anton Shilov on 3/13/2020
Rambus Develops HBM2E Controller & PHY: 3.2 Gbps, 1024-Bit Bus
The latest enhancements to the HBM2 standard will clearly be appreciated by developers of memory bandwidth-hungry ASICs, however in order to add support of HBM2E to their designs, they...
42 by Anton Shilov on 3/6/2020
ATP’s DDR4-3200 Industrial DIMMs: Up to 128GB @ 1.2V for AMD & Intel
ATP has unveiled its latest memory modules for servers and industrial applications, boasting a 3200 MT/s data transfer rate, an industry-standard voltage, and capacities ranging from 2 GB to...
7 by Anton Shilov on 3/5/2020
Samsung Starts Production of 16 GB LPDDR5-5500 for Smartphones
Samsung has begun mass production of the industry’s first 16 GB LPDDR5 memory for upcoming smartphones, such as the Galaxy S20 Ultra 5G handsets. The new DRAM devices not...
33 by Anton Shilov on 2/25/2020
SMART Modular Reveals 32 GB DDR4-3200 Low Profile Mini-DIMMs for Extreme Environments
SMART Modular has unveiled a new lineup of 32 GB Mini-DIMMs for extreme environments, such as industrial or telecommunication applications. The new high-density modules come in ULP (Ultra Low...
7 by Anton Shilov on 2/14/2020
G.Skill Launches 256 GB DDR4-3600 CL16 Memory Kit
The arrival of 32 GB unbuffered DIMMs has not only allowed mainstream systems to reach 128 GB of memory, but it's also allowed high-end desktops based on AMD Ryzen...
8 by Anton Shilov on 2/12/2020
SK Hynix Licenses DBI Ultra Interconnect for Next-Gen 3DS and HBM DRAM
SK Hynix has inked a new broad patent and technology licensing agreement with Xperi Corp. Among other things, the company licensed the DBI Ultra 2.5D/3D interconnect technology developed by...
9 by Anton Shilov on 2/11/2020
GIGABYTE Launches Designare DDR4-3200 Memory, a 64 GB Kit
GIGABYTE is a relatively new player on the memory market, yet it clearly wants to participate in the premier league. As seen at CES, this week the company introduced...
23 by Anton Shilov on 2/6/2020
Micron Shipping LPDDR5 DRAM
Micron has announced their first LPDDR5 DRAM is in mass production and now shipping to customers. The new RAM is significantly faster and more power efficient than LPDDR4x. One...
33 by Billy Tallis on 2/6/2020
JEDEC Updates HBM2 Memory Standard To 3.2 Gbps; Samsung's Flashbolt Memory Nears Production
After a series of piecemeal announcements from different hardware vendors over the past year, the future of High Bandwidth Memory 2 (HBM2) is finally coming into focus. Continuing the...
24 by Ryan Smith on 2/3/2020
SK Hynix to Cut CapEx, Accelerate Transitions, 1z nm DRAM & 128L 4D NAND in 2020
Following a massive revenue and profitability drop in 2019, SK Hynix has announced that it plans to cut down its capital expenditures. While the market has shown some signs...
6 by Anton Shilov on 2/3/2020
Crucial’s 32 GB UDIMMs and SODIMMs Available: DDR4-2666 & DDR4-3200
In the summer of 2019, Crucial was among the first brands to demonstrate 32 GB unbuffered memory modules, which were based on Micron’s 16 Gb DDR4 chips. Now after...
12 by Anton Shilov on 1/29/2020
The Corsair DDR4-5000 Vengeance LPX Review: Super-Binned, Super Exclusive
The consumer memory industry has been teasing DDR4-5000 for a few months now. We saw one company show some DDR4-5000 modules at Computex back in July 2019, running...
56 by Gavin Bonshor on 1/27/2020
Here's Some DDR5-4800: Hands-On First Look at Next Gen DRAM
Just like all major makers of DRAM, SK Hynix produced its first DDR5 memory chips a couple of years ago and has been experimenting with the technology since then...
39 by Anton Shilov on 1/13/2020
CES 2020: Kingston’s HyperX Adds 32 GB UDIMMs & New Fury Speed Bins to Lineup
Kingston’s HyperX division introduced a stack of new memory modules at CES 2020. Firstly, the company added 32 GB unbuffered DIMMs and SO-DIMMs to its Fury and Impact families...
11 by Anton Shilov on 1/10/2020
DRAMeXchange: Blackout at Samsung’s Fab Will Not Affect Commodity DRAM Prices in Q1
Following a power outage and consequent disruption of production at Samsung’s Line 13 fab in Hwaseong, South Korea, back on December 31, 2019, there had been some concerns about...
5 by Anton Shilov on 1/9/2020
Fire At Kioxia & Western Digital NAND Fab - Impact on Supply to be Minimal
Kioxia has reportedly informed its customers that a production tool at one of its fabs caught fire early on Tuesday. The fire was promptly extinguished and no casualties were...
6 by Anton Shilov on 1/8/2020
CES 2020: Micron Begins to Sample DDR5 RDIMMs with Server Partners
Micron announced at CES that it had started sampling of its DDR5 Registered DIMMs with select partners. The very fact that Micron started sampling of DDR5 modules indicates that...
7 by Anton Shilov on 1/7/2020
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